Intel Ships First 18A Chips, Betting IDM Model Can Match TSMC

Intel began shipping Core Series 3 processors on June 1, built on its 18A node with RibbonFET and PowerVia technologies. By skipping the intermediate 20A process, Intel signals it has resolved earlier manufacturing setbacks. The launch tests whether vertically integrated chip design and manufacturing can compete with the foundry-fabless model—and whether customers like AMD and others will trust Intel's advanced nodes for their own products.