Samsung Shows Concept for Stacking Memory on AI Chips

Samsung showed concept models at FMS 2026 in Santa Clara. The design stacks memory directly on top of AI accelerator chips using advanced chip-bonding technology. Samsung claims up to 8x performance, over 10x density versus the current HBM5 standard, and 3x energy efficiency. These are concepts, not products. Samsung also introduced V10 BV-NAND, stacking 400-plus layers for SSDs.